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DOWSIL™ EE-3200 Low Stress Silicone Encapsulant

非常に低い硬度および粘度を有しており、内部応力の発生を最小限に抑え、小さな隙間を充填したり、複雑かつ大量の電子機器の製造速度を高めるために使用できます。

利点:

  • Low modulus reduces pressure on components
  • Thermal conductivity effectively dissipates heat
  • Good mechanical adhesion avoids delamination issues
  • Fast cure and optimized working time allows for more complex designs and lower module cost
  • Dielectric strength and volume resistivity reduce costs as no additional dielectric barrier is required
  • Ease of use – low viscosity allows fast fill and fit with high throughput manufacturing processes
  • Minimal filler settling allows for ease of process control
  • Meets certification requirements

物性

これらの値は一般特性を表すもので、規格ではありません。

一般特性

  • 1 成分形または 2 成分形 はい いいえ 2液
  • ポットライフ はい いいえ 30 Minutes
  • 伸び はい いいえ 340 %
  • 体積抵抗率 はい いいえ 1000000000000000 Ω・cm
  • 引張強さ はい いいえ 33 psi
  • 混合粘度 はい いいえ 1700 Centipoise
  • 熱伝導率 はい いいえ 0.5 W/m・K
  • 特性 はい いいえ UL 認定取得済み
  • 硬化特性 はい いいえ 室温硬化、長いワーキングタイム > 20分
  • 硬度 はい いいえ ショア00, 000硬度スケールの高応力緩和エラストマー
  • 粘度/流動性 はい いいえ 高流動性500~3,000 cps
  • 絶縁破壊強さ はい いいえ 350 volts per mil v/mil
  • 線熱膨張係数 はい いいえ 360 um/m/Deg C
  • 色 B液 はい いいえ Black
  • 誘電正接(100 Hz) はい いいえ 0.006
  • 誘電率(100 Hz) はい いいえ 2.7
  • 誘電率(100 kHz) はい いいえ 2.7
  • 誘電率(1MHz) はい いいえ 2.7

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DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
この製品の技術データシートはオンラインでは取得できません
詳細については当社にお問い合わせください

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DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
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