物性
アプリケーションの利点 |
|
|---|---|
| Use | Boards and Assemblies, Components |
代表的な物性 |
|
|---|---|
| Linear CTE | 300 um/m/Deg C |
DOWSIL™ EE-1010 Low Viscosity Encapsulant Kit
概要
物性
技術資料
サンプル オプション
とは DOWSIL™ EE-1010 Low Viscosity Encapsulant Kit?
製造工程中に頻繁に開始/停止がある場合、あるいはボードやコンポーネントが複雑なために、内部の空気を頻繁に入れ替え、表面に浮かび上がらせ、真空脱気を要さずに遮断する必要がある場合などに適しています。
用途
- DOWSIL™ EE-1010 Low Viscosity Encapsulant is suitable for use in applications where there are frequent start/stops during the manufacturing process or where board and component complexity require more time for entrapped air to be displaced, rise to the surface, and break without requiring a vacuum de-airing step
- Material can be dispensed manually or through meter mixing
利点
- Long working time
- Room temperature cure or accelerated heat cure
- High hardness/durometer compared to other PCB system assemblies encapsulants
- Moderate thermal conductivity
- Different colors for Part A and Part B for easy identification of mixing
- In complex geometries, low viscosity enhances flow and fill in narrow spaces and long working time enables air displacement
- Rapid, versatile cure processing controlled by temperature