物性
アプリケーションの利点 |
|
---|---|
Use | Boards and Assemblies |
認証と規格 |
|
---|---|
Regulatory Approvals | UL Recognized |
製品の使用と処方 |
|
---|---|
Cure Type | Addition Cure |
Number of Parts | One Part No Mixing |
代表的な物性 |
|
---|---|
Color | Clear |
Cure Type | Heat Cure |
Dielectric Constant at 100 kHz | 2.84 |
Dielectric Strength | 525 volts per mil v/mil |
Heat Cure | 48 min @ 100°C, 6.6 min @ 125°C, 6.4 min @ 150°C |
Opacity | Transparent |
Penetration after cure | 85 |
Specific Gravity @ 25°C | 1 |
Thermal Conductivity | 0.20 W/m・K |
Viscosity | 700 mPa.s |