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DOWSIL™ 3-6385 Thermally Conductive Encapsulant Kit

Two part, 1:1 mix ratio, red, room temperature or fast heat curing, thermally conductive silicone encapsulant.

用途:

  • Potting of high voltage transformers and sensors

利点:

  • Designed to protect against mositure, environmental attack, mechanical and thermal shock as well as vibration especially where heat transfer is important and high hardness or high specific gravity of the product is required
  • Two part, 1:1 mixing ratio
  • Room temperature cure or rapid heat cure
  • Addition cure systems: no cure by-products
  • Stable and flexible from -50°C to +200°C

この製品の有効な安全データシート(SDS)がありません
詳細については当社にお問い合わせください

この製品はオンラインで食品接触用途向けレターの入手はできません
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DOWSIL™ 3-6385 Thermally Conductive Encapsulant Kit
この製品の技術データシートはオンラインでは取得できません
詳細については当社にお問い合わせください

CHOOSE

この製品の法規制データシート(RDS)はオンラインでは取得できません
詳細については当社にお問い合わせください

DOWSIL™ 3-6385 Thermally Conductive Encapsulant Kit
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