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DOWSIL™ TC-4515 Gap Filler A&B

A thermally Conductive Gap Filler offers thermal conductivity of 1.5W/m.K. As automotive electronics contribute ever greater value to automotive safety, reliability, performance and comfort, they are also generating higher temperatures that can reduce the functionality and reliability of modules over time.

利点:

  • Improved reliability in harsh temperatures – Effectively dissipate heat away from sensitive components. Withstand peak exposure at 200°C, and perform reliably at operating temperatures ranging up to 150°C.
  • Easy processing – These advanced thermally conductive materials dispense easily from their original packaging with minimal to no additional process preparation, making them well-suited for automated application using standard meter mix equipment.
  • Effective assembly – Avoid slumping on vertical surfaces during assembly. After cure, they maintain their vertical stability even after long use. Select formulations incorporate glass beads to control bond line thickness during assembly.
  • Cost-effective, fast cure – The platinum cure system enables fast, controlled cure at room temperature, although cure times can be accelerated further with heat to reduce manufacturing cycle times. No post-cure steps are required.
  • UL 94 V-0 recognition – Received recognition under Underwriters Laboratories UL 94 standard, which evaluates the flammability of plastic and silicone materials intended for parts in devices and appliances. Recognition under UL 94 is a step towards applying the UL label on your final product.
  • DOWSIL™ TC-4525 A/B

    A thermally Conductive Gap Filler offers thermal conductivity of 2.5W/m.K. This is a soft and compressible silicone material designed to dissipate heat from electronic modules by conducting it to a heat sink such as an aluminum housing. Excellent fit for automotive electronics and battery packs applications.


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DOWSIL™ TC-4515 Gap Filler A&B
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DOWSIL™ TC-4515 Gap Filler A&B


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DOWSIL™ TC-4515 Gap Filler A&B
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