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  2. DOWSIL™ TC-4551 CV Thermally Conductive Gap Filler

DOWSIL™ TC-4551 CV Thermally Conductive Gap Filler

5 W/m・K silicone gap filler, two-part material curing at room temperature.

혜택:

  • Thermal conductivity: 5.2 W/m・K
  • Room temperature cure or heat accelerated cure
  • Long term performance stability during temperature cycling up to 150°C
  • Holds vertical position in the assembly after cured
  • Controlled silicone volatility
  • UL 94 V-0 (0.15 mm, Thickness & 3.0 mm, Thickness)
  • soft and compressible material once cured
  • designed to dissipate the heat from PCB module assemblies mounted on printed circuit board to heat sink
  • provides a reliable cooling solution for electronics modules such as engine or transmission control units
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DOWSIL™ TC-4551 CV Thermally Conductive Gap Filler
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