젤, 인캡슐런트, 컨포멀코팅

Two-part, 1:1 mix ratio, transparent, room temperature or heat-accelerated cure gel intended for use in potting printed circuit board (PCB) system assemblies. SYLGARD™ 527 A&B Silicone Dielectric Gel is a low viscosity, very soft gel that is suitable for delicate components.

Two-part, 1:1 mix ratio, translucent, heat-accelerated cure gel intended for use in potting printed circuit board (PCB) system assemblies. DOWSIL™ EG-3896 Kit is a low viscosity, very soft gel with an extended operational temperature from -40°C - 185°C.

Two-part, 1:1 mix ratio, translucent green, room temperature or heat-accelerated cure gel intended for use in potting printed circuit board (PCB) system assemblies. DOWSIL™ 3-4207 Dielectric Tough Gel Kit is a low viscosity, tough gel with conditional primerless adhesion and good flame resistance.

Two-part, 10:1 mix ratio, transparent, room temperature or heat-accelerated cure elastomer intended for use in potting printed circuit board (PCB) system assemblies, power supplies, connectors, sensors, industrial controls, transformers, amplifiers, high voltage resistor packs and relays. SYLGARD™ 184 Silicone Elastomer Kit is a medium viscosity, firm elastomer that is UL recognized. Faster cure version of SYLGARD™ 182 Silicone Elastomer Kit.

Two-part, 1:1 mix ratio, dark gray, room temperature or heat-accelerated cure encapsulant intended for use in potting printed circuit board (PCB) system assemblies. DOWSIL™ EE-3200 Low Stress Silicone Encapsulant is a medium viscosity, soft encapsulant with moderate thermal conductivity.

Two-part, 1:1 mix ratio, black, heat-accelerated cure encapsulant intended for use in potting printed circuit board (PCB) system assemblies. SYLGARD™ 567 Primerless Silicone Encapsulant Kit is a medium viscosity, firm encapsulant with primerless adhesion.