속성
응용 프로그램 이점 |
|
|---|---|
| Use | Battery Pack, Boards and Assemblies, Components, Housings |
제품 사용 및 배합 |
|
|---|---|
| Number of Parts | One Part No Mixing |
대표적 특성 |
|
|---|---|
| Color | Clear |
| Cure Type | Heat Cure |
| Dielectric Strength | 500 volts per mil v/mil |
| Heat Cure | 30 min @ 150°C |
| Opacity | Transparent |
| Penetration after cure | 85 |
| Specific Gravity @ 25°C | 0.97 |
| Thermal Conductivity | 0.17 W/m・K |
| Viscosity | 775 mPa.s |