속성
대표적 특성 |
|
|---|---|
| Color | Gray |
| Cure Type | Heat accelerated cure |
| Durometer - Shore A | 91 |
| Heat Cure | 120 min @ 150 °C |
| Material Type | Adhesive |
| Number of Parts | 1 part |
| Specific Gravity | 4.4 |
DOWSIL™ ME-1800 Adhesive
개요
속성
기술적인 내용
샘플 옵션
무엇입니까 DOWSIL™ ME-1800 Adhesive?
One-part, gray, 6.8 W/mK thermally conductive adhesive formulated for sealing and bonding components in electronics applications, such as grounding, die attach, and microelectronics. DOWSIL™ ME-1800 Adhesive is a heat cure product with high thermal and electrical conductivity.
사용
- Heat dissipation
- Sealing
- Bonding
- Thermal interface material (TIM)
혜택
- Thermal conductivity: 6.8 W/mK
- Volume resistivity: 1.8*10-4 ohm-cm
- Heat cure: 120 min at 150 °C
- Adhesion: 1.3 MPa aluminum lap shear joint
- Thermal resistance: 0.06 °C-cm2/W - 10 µm BLT
- Good adhesion to Ni, Al, laminate, and silicon
- Microelectronics grade