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DOWSIL™ ME-1800 Adhesive

개요
샘플 옵션
구매 옵션
기술적 인 내용
기술적 인 내용
Distributor Availability

Conductive adhesive with high electrical/thermal conductivity.

사용:

Conductive adhesive for grounding
Suitable for microelectronics thermal interface applications

혜택:

High electrical conductivity (Enables electrically conductive performance)
High thermal conductivity (Increases reliability by removing heat)
Good adhesion to Ni, Al, laminate, and silicon (Good for die attach, lid seal, or TIM1)
Low ionic impurities (Microelectronics grade material)

속성

*이 값은 일반적인 속성이며 제품 사양에는 사용되지 않습니다.

물리적 특성

경화 특성 Yes No 열경화 >100C
색상 Yes No Gray
특성 Yes No 원파트

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DOWSIL™ ME-1800 Adhesive

사용:

혜택:

속성

물리적 특성

현재 번들 가격 없음

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