속성
제품 사용 및 배합 |
|
|---|---|
| Cure Characteristics | Heat Cure greater than 100C |
대표적 특성 |
|
|---|---|
| Color | Translucent/Clear |
| Number of Parts | One Part |
| Product Type | Adhesive / Sealant |
DOWSIL™ ME-1180 Adhesive Clear
개요
속성
기술적인 내용
샘플 옵션
무엇입니까 DOWSIL™ ME-1180 Adhesive Clear?
One-part, heat cure, translucent, self-priming adhesive.
사용
- Die Attach Adhesive, Globe top encapsulation
- Sealing, encapsulation, adhesive for PCB system assemblies
혜택
- Proven excellent jet dispensability which enables:
- Design flexibility with fine, precise patterning
- Ease to optimize parameter for jet dispensing
- Solvent-less, low viscosity
- Well balanced thixo and flow properties
- Moderate Young's modulus
- Volatile controlled