속성
응용 프로그램 이점 |
|
|---|---|
| Use | Components |
대표적 특성 |
|
|---|---|
| Dissipation Factor at 100 Hz | 0.0011 |
| Dissipation Factor at 100 kHz | < 0.0002 |
| Unprimed Adhesion - Lap Shear | 960 psi |
DOWSIL™ 7920-LV Die Attach Adhesive
개요
속성
기술적인 내용
샘플 옵션
무엇입니까 DOWSIL™ 7920-LV Die Attach Adhesive?
1-part black, flowable, low viscosity high strength adhesive with self priming adhesion
사용
- Microelectronics applications requiring good adhesion and reliability
혜택
- Heat cure enables flexible cure options
- Low modulus for reduced stress
- Optimized viscosity for ease-of-application
- Solventless to minimize potential for voiding
- Adhesion to commonly-used microelectronics substrates