속성
응용 프로그램 이점 |
|
---|---|
Use | Boards and Assemblies |
제품 사용 및 배합 |
|
---|---|
Cure Type | Addition Cure |
Number of Parts | Two Part |
Temperature Stable | Low |
Working Time at 25°C | 30 Minutes |
대표적 특성 |
|
---|---|
Color | Clear |
Cure Type | Heat Cure, Room Temperature Cure |
Dielectric Strength | 460 volts per mil v/mil |
Heat Cure | 60 Minutes @ 125 °C |
Opacity | Transparent |
Penetration after cure | 105 |
Specific Gravity @ 25°C | 0.97 |
Thermal Conductivity | 0.15 W/m・K |
Viscosity | 12500 mPa.s |