Dependable materials for dependable power
When it comes to power management and automation, one thing is certain – the advanced electronic assemblies that make up the system must be dependable and high-performing, especially in outdoor, toxic and high-energy environments.
Whether the task is transmission, distribution, circuit protection, metering, process automation or analytic instrumentation, we have the collaborative expertise and materials to help your advanced electronics perform reliably in these demanding environments, year after year.
Dow silicone solutions provide stress-relieving properties to help manufacturers achieve higher system value and lower system costs.
- Low modulus reduces pressure on components
- Enhanced thermal conductivity for reliable operation from -60°C to +200°C
- Low viscosity to minimize internal stress generation, fill small gaps and improve manufacturing speed for complex and high volume electronic devices
DOWSIL™ EE-3200 Low Stress Silicone Encapsulant combines the stress-relieving properties of a gel with the thermal conductivity of an encapsulant to protect sensitive components in harsh environmental conditions.
DOWSIL™ EG-3810 Dielectric Gel delivers long-lasting performance as a protective potting material for power conversion applications through its unique combination of thermal stability and low modulus.
We can work together to provide your electronics with protection against moisture, chemicals, vibration and shock, while also optimizing your costs and productivity. Connect with us to learn more.