Propiedades

Beneficios de la Aplicación

Use Boards and Assemblies

Uso y formulación del producto

Cure Type Addition Cure
Number of Parts Two Part
Temperature Stable Low
Working Time at 25°C 30 Minutes

Propiedades tipicas

Color Clear
Cure Type Heat Cure, Room Temperature Cure
Dielectric Strength 460 volts per mil v/mil
Heat Cure 60 Minutes @ 125 °C
Opacity Transparent
Penetration after cure 105
Specific Gravity @ 25°C 0.97
Thermal Conductivity 0.15 W/m・K
Viscosity 12500 mPa.s