DOWSIL™ TC-5888 Thermally Conductive Compound

O que é DOWSIL™ TC-5888 Thermally Conductive Compound?

One-part, gray, 5.2 W/mK thermally conductive compound formulated to dissipate heat in electronics applications, such as microprocessor units (MPU) and power modules. DOWSIL™ TC-5888 Thermally Conductive Compound is non-curing, with low thermal resistance.

Usos

Minimizing thermal resistance
Thermal interface material (TIM)

Benefícios

Thermal conductivity: 5.2 W/mK
Thermal resistance: 0.05 °C-cm2/W @ 20 µm gap
One part material – no cure required
Solvent free formulation – provides material stability
Easy application – Screen printable
Thixotropic – low slump

Propriedades

Propriedades típicas
Bond-line Thickness at 40 psi	20 um (Microns)
Color	Gray
Cure Type	No cure
Material Type	Compounds and Greases
Number of Parts	1 part
Specific Gravity	2.6
Thermal Conductivity	5.2 W/m・K
Thermal Resistance at 40 psi	0.05 Deg C-cm2/W

DOWSIL™ TC-5888 Thermally Conductive Compound

O que é DOWSIL™ TC-5888 Thermally Conductive Compound?

Usos

Benefícios

Propriedades

Propriedades típicas

RECURSOS

EDUCAÇÃO

EMPRESARIAL

JURÍDICO