O que é DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler?
A soft and compressible material once cured, designed to dissipate the heat from electronics mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission control unit.
Usos
Designed to dissipate the heat from components mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission control unit
This material is specifically designed for a smooth assembly process line integration ideally suited for automated dispensing with meter mix equipment
Benefícios
Thermal conductivity: > 2.5 W/m-K
Room temperature cure
Long term performance stability during temperature cycling up to 150°C