For powerful protection from heat
Thermally conductive silicones from Dow come in a wide range of viscosities, cure speeds and delivery systems to meet the growing need for improved thermal management in electronics designs for virtually every industry.
Automotive and transportation: From rail to road, vehicles are increasingly reliant on electronics for everything from optimized fuel consumption and safety to propulsion and braking. As this trend accelerates, it will drive demand for higher performance and more cost-effective thermal management solutions.
Consumer electronics and communications: Form factor optimization is one of the challenges facing this industry. Thin is in for consumer devices, requiring compact, multifunctional thermal management solutions.
Power and industrial: Power supplies and controls for industry, computer servers, and solar and wind energy are all managing higher electrical loads and, with them, increasing temperatures. The trend is creating a need for improved thermal management to dissipate heat in these devices, as this translates into improved performance, reliability and lifetime. Improved thermal management also offers needed design flexibility.
What’s best for your application?
Thermally conductive adhesives are suitable for bonding and sealing hybrid circuit substrates, semiconductor components, heat spreaders and other applications that demand broad design, flexible processing options and excellent thermal management. One part moisture-cure grades offer simple room-temperaure processing to minimize costs. One or two-art heat cure solutions help to accelerate processing to speed time to market.
Thermally conductive compounds, commonly called greases, serve as a thermal bridge that draws heat away from a device’s sensitive electronic components and dissipates it into the ambient environement. These no-cure materials offer relatively low cost, ease of application on heat sinks via screen rating and ease of rework.
Thermally conductive encapsulants and gels come in a wide range of adaptable products for encapsulation and potting applications. The low viscosity before cure of these products enables them to process easily and fully embed tall components, delicate wires and solder joints. They are particularly suitable for managing high heat in complicated electronic module component architectures. (NOTE: Brochure refers to these as elastomers and gels – we’ve changed to encapsulants and gels to be consistent with product page title for these products.)
Our dispensable thermal pads enable you to quickly and precisely dispense or print a layer of thermally conductive silicone compound in controllable thicknesses on complex substrate shapes, helping to ensure excellent thermal management and lower cost of ownership compared to prefabricated thermal pads.