DOWSIL™ TC-3080 Curable Thermal Gel

Qué es DOWSIL™ TC-3080 Curable Thermal Gel?

One-part, 7.0 W/mk thermally conductive ultra soft gel formulated to dissipate heat in electronics applications, such as arrayed power chips, 5G, autonomous vehicles, and telecommunications. DOWSIL™ TC-3080 Curable Thermal Gel is a room temperature cure product with accelerated heat cure that is ultra soft and has a long working time.

Usos

Heat dissipation
Vibration damping
Stress relief
Thermal interface material (TIM)

Beneficios

Thermal conductivity: 7.0 W/mK
Room temperature or heat-accelerated cure
Cure time: 30 days at 25 °C, 30 min at 80 °C
Hardness: 60 Shore 000
Designed for low minimum Bondline thickness (BLT)
Long working time
Low assembly force

Propiedades

Propiedades tipicas
Color	Blue
Cure Type	Heat accelerated cure, Room temperature cure
Durometer - Shore 000	60
Heat Cure	30 min @ 80 °C
Material Type	Gel
Number of Parts	1 part
Specific Gravity	3.4
Thermal Conductivity	7 W/m・K

DOWSIL™ TC-3080 Curable Thermal Gel

Qué es DOWSIL™ TC-3080 Curable Thermal Gel?

Usos

Beneficios

Propiedades

Propiedades tipicas

RECURSOS

EDUCACIÓN

CORPORATIVO

LEGAL