DOWSIL™ TC-3066 Curable Thermal Gel

Qué es DOWSIL™ TC-3066 Curable Thermal Gel?

One-part, 6.6W/mK thermally conductive gel formulated to dissipate heat in electronics applications, such as electronic module assemblies, 5G smart devices, and telecommunications. DOWSIL™ TC-3066 Curable Thermal Gel is a room temperature cure product with accelerated heat cure.

Usos

Heat dissipation
Vibration damping
Stress relief
Thermal interface material (TIM)

Beneficios

Thermal conductivity: 6.6 W/mK
Room temperature or heat-accelerated cure
Cure time: 7 days at 25 °C, 30 min at 80 °C
Hardness: 60 Shore 00
Designed for low minimum Bondline thickness (BLT)
Long working time

Propiedades

Propiedades tipicas
Color	Blue
Cure Type	Heat accelerated cure, Room temperature cure
Durometer - Shore 00	60
Heat Cure	30 min @ 80 °C
Material Type	Gel
Number of Parts	1 part
Specific Gravity	3.4
Thermal Conductivity	6.6 W/m・K

DOWSIL™ TC-3066 Curable Thermal Gel

Qué es DOWSIL™ TC-3066 Curable Thermal Gel?

Usos

Beneficios

Propiedades

Propiedades tipicas

RECURSOS

EDUCACIÓN

CORPORATIVO

LEGAL