DOWSIL™ TC-3060 Thermal Gel

Qué es DOWSIL™ TC-3060 Thermal Gel?

One-part, blue, 6.5 W/mK thermally conductive gel formulated to dissipate heat in electronics applications, such as smart phones, printed circuit board (PCB) assemblies, and memory chips. DOWSIL™ TC-3060 Thermal Gel is a reworkable, room temperature cure product with accelerated heat cure.

Usos

Heat dissipation
Vibration damping
Stress relief
Thermal interface material (TIM)

Beneficios

Thermal conductivity: 6.5 W/mK
Room temperature or heat-accelerated cure
Cure time: 7 days at 25 °C, 30 min at 100 °C
Hardness: 60 Shore 00
Reworkable

Propiedades

Propiedades tipicas
Color	Blue
Cure Type	Heat accelerated cure, Room temperature cure
Durometer - Shore 00	60
Heat Cure	30 min @ 100 °C
Material Type	Gel
Number of Parts	1 part
Specific Gravity	3.5
Thermal Conductivity	6.5 W/m・K

DOWSIL™ TC-3060 Thermal Gel

Qué es DOWSIL™ TC-3060 Thermal Gel?

Usos

Beneficios

Propiedades

Propiedades tipicas

RECURSOS

EDUCACIÓN

CORPORATIVO

LEGAL