DOWSIL™ ME-4139 Encapsulant Dark Grey

Qué es DOWSIL™ ME-4139 Encapsulant Dark Grey?

One-part, dark grey, heat cure, controlled thixotropy-flowable as dispensed, self-priming adhesion.

Where a semiconductor die has been wire bonded to a flat surface.
Where there is a need for a flexible coating
- wide extremes of temperature, with the use of a pliable epoxy substrate or where severe thermal shocks are encountered
Compatible with most semiconductor devices and provides environmental and physical protection of both the chip and interconnecting wires in a single application

app.properties.Title
Use	Boards and Assemblies, Components

product.use.formulating.properties.Title
Number of Parts	One Part No Mixing