Propiedades
Beneficios de la Aplicación |
|
|---|---|
| Use | Boards and Assemblies |
Certificaciones y estándares |
|
|---|---|
| Regulatory Approvals | UL Recognized |
Uso y formulación del producto |
|
|---|---|
| Cure Type | Addition Cure |
| Number of Parts | One Part No Mixing |
Propiedades tipicas |
|
|---|---|
| Color | Clear |
| Cure Type | Heat Cure |
| Dielectric Strength | 525 volts per mil v/mil |
| Heat Cure | 48 min @ 100°C, 6.6 min @ 125°C, 6.4 min @ 150°C |
| Opacity | Transparent |
| Penetration after cure | 85 |
| Specific Gravity @ 25°C | 1 |
| Thermal Conductivity | 0.20 W/m・K |
| Viscosity | 700 mPa.s |