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电子产品用粘合剂和密封胶

释放粘接和粘附的应力

成熟的性能。灵活的加工选项。更简单的装配和热管理。提高可靠性。卓越的粘接性。无论您想要什么样的结果,粘合剂和密封剂在保护电子元件、先进装配和照明组件免受环境压力和潮湿影响方面起着关键作用,即使是最苛刻的应用也是如此。

从保护重型机械免受恶劣的室外环境到保护敏感的电子电路免受机械应力,再到确保子组件和大型装配的安全基础,以加强轻质材料之间的粘合,我们的下一代有机硅粘合剂和密封剂为电子元件与照明制造商和设计师提供了众多优势。凭借在-45°C至275°C的工作温度范围内可靠的性能,我们成熟的非腐蚀性密封剂和粘合剂产品组合可提供多种粘度和固化化学品,以满足您的加工需求。

单组分湿气固化(RTV)有机硅

这些硫化粘合剂不需要混合或烘箱设备来处理,可以从环境空气中吸收水分,在室温下简单且经济高效地固化。可以通过提高温度和湿度来加速固化。

双组分室温缩合固化弹性体

这些多功能、快速固化的弹性体提供不流动和可流动的选项,可用于盖子和外壳密封以及衬垫应用。

加速热固化粘合剂

标准级别产品具有更高的控制和加工灵活性,可在150°C的环境温度下在最短20至30分钟内即完成粘合,而高性能级别产品可在相同温度下在数分钟内固化。

热固化有机硅弹性体

这些耐用的弹性体有可流动和不流动两种选择,可快速加工密封盖、外壳和垫圈。

热熔有机硅粘合剂

这些粘合剂通过无底漆粘合的方式粘合到玻璃、塑料、金属和许多其他基材,可以作为液体熔体涂覆,但会冷却成固体并形成粘弹性材料,当它们与环境湿气反应时物理性能进一步增强。

灵活的紫外线固化粘合剂

这些粘合剂提供了通过紫外线(UV)能量照射实现更快的在线加工方案。

有机硅泡沫

这些泡沫在密封高耐受性间隙时可以经济有效地替代预制垫片和泡沫胶带,有助于减少浪费并加快生产,同时针对环境空气、湿气、灰尘、蒸汽、振动、热量等提供保护。


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