A one-part, thixotropic non-flowing adhesive used in a variety of automotive electronic applications such as control units, modules, sensors, and ADAS devices including under hood applications.
用途
Battery pack
EV controllers
On-board charger
Control units
Autonomous steering
Automotive electrical housings
Electronic module assembly
Inverter/converter
E-motor
Electric power steering
Automotive boards & assemblies
Housings
优势
Solvent free
Heat accelerated cure
Adhesion to common engineering metals
Robust toughness
Suitable for use to -45°C or lower
Deep section cure
Non-slumping
Designed to adhere common engineering plastics
Low modulus for stress relief
Suitable for long term use at +150°C and shorter term to +200°C or higher