性能
应用优势 |
|
|---|---|
| Use | Battery Pack, Boards and Assemblies, Components |
产品使用和配方 |
|
|---|---|
| Number of Parts | One Part No Mixing |
典型特性 |
|
|---|---|
| Color | Clear |
| Cure Type | Heat Cure |
| Dielectric Strength | 560 volts per mil v/mil |
| Heat Cure | 60 min @ 120°C |
| Opacity | Transparent |
| Penetration after cure | 20 |
| Specific Gravity @ 25°C | 0.98 |
| Thermal Conductivity | 0.15 W/m・K |
| Viscosity | 375 mPa.s |