性能
应用优势 |
|
---|---|
Use | Battery Pack, Boards and Assemblies, Components |
产品使用和配方 |
|
---|---|
Number of Parts | One Part No Mixing |
典型特性 |
|
---|---|
Color | Clear |
Cure Type | Heat Cure |
Dielectric Strength | 560 volts per mil v/mil |
Heat Cure | 60 min @ 120°C |
Opacity | Transparent |
Penetration after cure | 20 |
Specific Gravity @ 25°C | 0.98 |
Thermal Conductivity | 0.15 W/m・K |
Viscosity | 375 mPa.s |