DOWSIL™ TC-5888 Thermally Conductive Compound
优势:
- One-Part Material: No cure is required when applying the material.
- Excellent Stay-ability: Features unique rheological properties that limit its flow beyond a target interface once assembled. This flow characteristic distinguishes it from lower viscosity thermal compounds, and provides greater control for applications requiring a thicker thermal compound layer or greater precision when dispensing compound between surface interfaces.
- Thermal Stability: Delivers consistent performance and reliability under high temperatures.
- Good Processability: Offers low volatile content versus competitive thermal compounds, allowing for more consistent rheology, application repeatability, and easier screen printing overall.
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该材料无在线“食品接触材料合规文件” 如需了解更多信息,请 联系陶氏。
该材料无在线“食品接触材料合规文件”
如需了解更多信息,请 联系陶氏。
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