DOWSIL™ TC-5888 Thermally Conductive Compound
Gray, thixotropic, non-curing thermally conductive compound. Thermally Conductive Compound is designed to provide efficient thermal transfer for the cooling of modules, including computer MPUs and power modules.
优势:
- One-Part Material: No cure is required when applying the material.
- Excellent Stay-ability: Features unique rheological properties that limit its flow beyond a target interface once assembled. This flow characteristic distinguishes it from lower viscosity thermal compounds, and provides greater control for applications requiring a thicker thermal compound layer or greater precision when dispensing compound between surface interfaces.
- Thermal Stability: Delivers consistent performance and reliability under high temperatures.
- Good Processability: Offers low volatile content versus competitive thermal compounds, allowing for more consistent rheology, application repeatability, and easier screen printing overall.
此材料没有安全数据说明书 如需了解更多信息，请 联系陶氏。
此材料没有安全数据说明书
如需了解更多信息，请 联系陶氏。
该材料无在线“食品接触材料合规文件” 如需了解更多信息，请 联系陶氏。
该材料无在线“食品接触材料合规文件”
如需了解更多信息，请 联系陶氏。
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