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DOWSIL™ TC-5888 Thermally Conductive Compound

Gray, thixotropic, non-curing thermally conductive compound. Thermally Conductive Compound is designed to provide efficient thermal transfer for the cooling of modules, including computer MPUs and power modules.

优势:

  • One-Part Material: No cure is required when applying the material.
  • Excellent Stay-ability: Features unique rheological properties that limit its flow beyond a target interface once assembled. This flow characteristic distinguishes it from lower viscosity thermal compounds, and provides greater control for applications requiring a thicker thermal compound layer or greater precision when dispensing compound between surface interfaces.
  • Thermal Stability: Delivers consistent performance and reliability under high temperatures.
  • Good Processability: Offers low volatile content versus competitive thermal compounds, allowing for more consistent rheology, application repeatability, and easier screen printing overall.

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DOWSIL™ TC-5888 Thermally Conductive Compound
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