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  2. DOWSIL™ TC-5515 LT Low Density Thermal Conductive Gap Filler

DOWSIL™ TC-5515 LT Low Density Thermal Conductive Gap Filler

一款双组份室温固化2.0 W/m·K导热系数的低密度有机硅填缝剂，固化后柔软可压缩。专门设计用于新能源汽车电池与控制单元模块的散热，在模拟的典型环境暴露下性能稳定，从而提供了可靠的散热解决方案。

用途:

  • 动力电池组装 电控单元模块组装

优势:

  • 导热
  • 良好的耐久性
  • 低密度，轻量化与降低总成本
  • 阻燃通过UL94V0测试
  • 设备维护成本低

低密度导热填缝剂，可靠的导热系数及性能，适用于电动汽车电池组装及轻量化设计。

电动汽车(EV)是一个新兴的蓬勃发展的市场，因此电动汽车电池组是一个关键的组成部分。热管理对电动汽车电池组的安全性和寿命至关重要。目前，导热填缝材料正逐渐成为电动汽车电池散热的一种关键的热界面材料。为了抓住这一快速增长的市场，陶氏化学公司开发了TC-5515 LT低密度导热填缝剂，该填隙材料重量轻(密度1.95 g/cm3)、导热性好(2.0 W/m·K)、性能可靠，适用于EV的电池组装及轻量化设计。

DOWSIL™ TC-5515 LT Low Density Thermal Conductive Gap Filler Video

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