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  2. DOWSIL™ TC-4535 CV Thermally Conductive Gap Filler

DOWSIL™ TC-4535 CV Thermally Conductive Gap Filler

一种柔软的一次固化压缩性材料，用于安装在印刷电路板上的电子元件及散热器等的散热，可为发动机或传输控制装置提供可靠的冷却解决方案。

用途:

  • DOWSIL™ TC-4535 CV Thermally Conductive Gap Filler is a soft and compressible material once cured, designed to dissipate the heat from PCB module assemblies mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission control unit

优势:

  • Thermal conductivity: 3.5 W/m.K
  • Room temperature cure or heat accelerated cure
  • Long term performance stability during temperature cycling up to 150°C
  • Holds vertical position in the assembly for long service period
  • Controlled silicone volatility
  • UL 94 V-0

性能

这些数值为典型性能，并且不用于在规格制定过程中使用。

物理特性

  • A组分黏度 是 否 200 Pa.s
  • B组分黏度 是 否 230 Pa.s
  • Color - Part A 是 否 White
  • Shelf Life 是 否 360 Days
  • Thixotropic 是 否 3.6
  • 介电常数 1MHz 是 否 6.5/5E-3
  • 体积电阻率 是 否 3E+13 Ω・cm
  • 导热率 是 否 3.5 W/m・K
  • 混合后的粘度 是 否 205 Centipoise

加工-配方的优势

  • Working Time 是 否 60 minutes at 25 degree C
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