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DOWSIL™ TC-3065 Thermal Gel

单组分,6.5W/mk导热凝胶。它适用于丝网印刷和自动点胶,以取代预制的导热垫片。用于传递热能、应力消除和减震。室温固化,或60℃以上加速固化,以缩短固化时间。

用途:

  • 电信设备或器材,例如光通讯、以太网交换机、路由器等。
  • 数据通信设备,如高速固态磁盘(SSD)

优势:

  • 高导热系数(6.5W/mk)
  • 卓越的挤出率(60克/分钟),支持简单的自动点胶过程
  • 抵抗潮湿和其他恶劣环境,避免开裂和垂流现象
  • 挥发性含量超低

性能

这些数值为典型性能,并且不用于在规格制定过程中使用。

典型性能

  • Shelf Life 365 Days
  • Working Time 7200 Minutes
  • 体积电阻率 7 E+13 Ω・cm
  • 导热率 6.5 W/m・K
  • 延伸率 20 %
  • 比重 3.45
  • 硬度-Shore 00 50

高挤出率导热凝胶,具有强热导性,低挥发性

我们如何才能同时满足5G技术和可持续性的需求? 5G需要更大的功率设计,从而产生更大的热量。具有如此高温度输出的技术十分需要高性能散热的材料。这些材料必须具有低挥发性(VOC),必须是环保的。为了满足这两方面的需求,需要使用像DOWSIL™ TC-3065 Thermal Gel这样的材料。

DOWSIL™ TC-3065 Thermal Gel是一种单组分热固化有机硅导热凝胶,具有良好的可重工性能。它呈现为不流动的糊状物,在热管理应用中可以压至150微米的厚度。它可以固化成有弹性的垫片,具有抗拉强度和伸长率,使材料在返工过程中很容易被剥离,完全没有残留。该材料含超低VOC,能抗潮湿等恶劣环境,无沥油、不开裂、无垂流。因此,DOWSIL™ TC-3065 Thermal Gel不仅使5G技术发挥其作用,并有助于5G技术的可持续发展,而且优化了该技术的组装过程。

DOWSIL™ TC-3065 Thermal Gel 视频

了解有助于5G技术发挥作用并促进可持续发展的导热硅凝胶。

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DOWSIL™ TC-3065 Thermal Gel
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DOWSIL™ TC-3065 Thermal Gel
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