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DOWSIL™ TC-3065 Thermal Gel

单组分,6.5W/mk导热凝胶。它适用于丝网印刷和自动点胶,以取代预制的导热垫片。用于传递热能、应力消除和减震。室温固化,或60℃以上加速固化,以缩短固化时间。

用途:

  • 电信设备或器材,例如光通讯、以太网交换机、路由器等。
  • 数据通信设备,如高速固态磁盘(SSD)

优势:

  • 高导热系数(6.5W/mk)
  • 卓越的挤出率(60克/分钟),支持简单的自动点胶过程
  • 抵抗潮湿和其他恶劣环境,避免开裂和垂流现象
  • 挥发性含量超低

性能

这些数值为典型性能,并且不用于在规格制定过程中使用。

典型性能

  • 体积电阻率 7 E+13 Ω・cm
  • 保质期 365 Days
  • 可操作时间 7200 Minutes
  • 导热率 6.5 W/m・K
  • 延伸率 20 %
  • 比重 3.45 g/cm3
  • 硬度-Shore 00 50 Shore 00

High extrusion rate thermal gel with strong thermal conductivity and low voltile content

How can we meet the demands of both 5G technology and sustainability? 5G designs require greater power densities, which produce greater heat. Technology with such high temperature output requires materials that help dissipate the heat. And those materials must also have low volatile content (VOC) if they are to be eco-friendly. To meet both needs requires materials like DOWSIL™ TC-3065 Thermal Gel.

DOWSIL™ TC-3065 Thermal Gel is a one-part, heat cure silicone based thermally conductive gel with good re-workability. It’s supplied as non-flowable paste and can be pressed lower to 150 um thickness in thermal management applications. It can be cured to an elastic pad, with tensile strength and elongation that enables the material to be peeled off easily and completely without residue in the rework process. This material contains ultra low VOC, and can resist humidity and other harsh environments without oil-bleeding, cracking and slumping. Thus, DOWSIL™ TC-3065 Thermal Gel not only enables your 5G technology to function and contributes to sustainability but optimizes the process by which that technology is assembled.

DOWSIL™ TC-3065 Thermal Gel Video

Learn about a thermally conductive silicone gel that helps enable 5G technology to function and contributes to sustainability.

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DOWSIL™ TC-3065 Thermal Gel
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