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DOWSIL™ TC-3060 Thermal Gel

这是一款单组份,蓝色,可自动点胶的,可固化的有机硅高性能导热凝胶。可在室温或更高温度下加速固化。它不仅可以在潮湿和其他恶劣环境中不会开裂和产生垂流现象,而且固化后还具有可重工性能,这使得它成为智能手机理想的热界面材料。

用途:

  • 智能手机

优势:

  • 高导热性
  • 卓越的挤出率,支持简单的自动点胶过程
  • 抗潮湿和其他恶劣环境,避免开裂和垂流现象
  • 可重工

5G智能手机高性能可重工导热凝胶

通过采用更高频率的信号,5G智能手机芯片和组件比4G手机产生更多的热量。为了保证高质量的体验,你考虑过更强的导热技术吗?

DOWSIL™ TC-3060 Thermal Gel是一种单组分、蓝色、热固化有机硅导热凝胶,具有良好的可重工性能。适用于自动点胶,可以固化成有弹性的垫片,具有抗拉强度和伸长率,使材料在反攻过程中容易被剥离,完全没有残留。这种材料还可以抵抗潮湿和其他恶劣的环境,避免开裂和垂流现象。因此,DOWSIL™ TC-3060 Thermal Gel优化了手机组装过程,并使5G智能手机体功能得以发挥得淋漓尽致。

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DOWSIL™ TC-3060 Thermal Gel
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DOWSIL™ TC-3060 Thermal Gel
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