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DOWSIL™ TC-3015 Re-workable Thermal Gel

是一种单组分、热固化有机硅导热凝胶,具有良好的可重工性能。作为一款不可流动的膏状材料,在热管理应用中,可压到低至 100 微米的厚度。该材料固化后形成具有一定拉伸强度和伸长率的弹性垫,有助于实现电子设备在循环使用过程中的轻松拆卸及无残留剥离。

性能

这些数值为典型性能,并且不用于在规格制定过程中使用。

典型性能

  • Color Light Pink
  • Dielectric Strength 0.37338 volts per mil v/mil
  • Shelf Life 365 Days
  • 体积电阻率 5.9 E+14 Ω・cm
  • 导热率 2 W/m・K
  • 延伸率 72 %
  • 拉伸强度(SI) 0.3 MPa
  • 比重 2.6
  • 硬度-Shore 00 72
  • 粘度 220000 mPa.s

DOWSIL™ TC-3015 Thermal Conductive Silicone Gel是一种用于提升智能手机热管理性能的单组分有机硅材料。

通常在室温下即可固化,无需单独的固化流程。此外,更快的固化速度可通过提高固化温度实现,建议的最高固化温度为150℃。

固化前具备出色的润湿性,能够确保较低的接触热阻,即便在智能手机集成电路(IC)和中央处理器(CPU)等发热量较多的部件中,也不会形成过热区域。

作为一种适合点胶工艺的材料,DOWSIL™ TC-3015 Thermal Conductive Silicone Gel点胶工艺能够集成到自动化生产流程中,避免了耗时的导热垫片贴敷过程。

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观看视频,了解这种创新型材料是如何自动化喷涂来提高制造效率的,以及如何无残留地完整剥落从而方便维修的。

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DOWSIL™ TC-3015 Re-workable Thermal Gel
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DOWSIL™ TC-3015 Re-workable Thermal Gel
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