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  2. DOWSIL™ TC-2022 Thermally Conductive Adhesive

DOWSIL™ TC-2022 Thermally Conductive Adhesive

A one-part gray, thermally conductive, heat cure adhesive whose heat cure rate is rapidly accelerated with heat, and with high tensile strength and 7 mil glass beads.

用途:

  • Bonding integrated circuit substrates
  • Heat sink attach, automated or manual dispensing
  • Engine, power and transmission control units
  • Sensors

优势:

  • Primerless adhesion to a variety of substrates
  • Heat curable at moderate temperatures (100°C)
  • Good thermal conductivity values (1.7W/mK)
  • No added solvents
  • No mixing of separate components required
  • Improved cost effectiveness with rapid/low temperature cure
  • Heat flow away from electronic components can increase reliability
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