DOWSIL™ TC-2022 Thermally Conductive Adhesive
A one-part gray, thermally conductive, heat cure adhesive whose heat cure rate is rapidly accelerated with heat, and with high tensile strength and 7 mil glass beads.
用途:
- Bonding integrated circuit substrates
- Heat sink attach, automated or manual dispensing
- Engine, power and transmission control units
- Sensors
优势:
- Primerless adhesion to a variety of substrates
- Heat curable at moderate temperatures (100°C)
- Good thermal conductivity values (1.7W/mK)
- No added solvents
- No mixing of separate components required
- Improved cost effectiveness with rapid/low temperature cure
- Heat flow away from electronic components can increase reliability
此材料没有安全数据说明书 如需了解更多信息,请 联系陶氏。
此材料没有安全数据说明书
如需了解更多信息,请 联系陶氏。
该材料无在线“食品接触材料合规文件” 如需了解更多信息,请 联系陶氏。
该材料无在线“食品接触材料合规文件”
如需了解更多信息,请 联系陶氏。
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