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DOWSIL™ ME-4139 Encapsulant Dark Grey

单组分、深灰色、热固化、可控粘稠性、点胶时流动、自吸粘附能力。

用途:

  • Where a semiconductor die has been wire bonded to a flat surface.
  • Where there is a need for a flexible coating
    • wide extremes of temperature, with the use of a pliable epoxy substrate or where severe thermal shocks are encountered
  • Compatible with most semiconductor devices and provides environmental and physical protection of both the chip and interconnecting wires in a single application

优势:

  • High purity
  • Controlled thixotropy and yet flowable as dispensed
  • Optimum coating to cover bonding wires
  • Flexibility over a wide temperature range
  • Excellent dielectric properties
  • Excellent adhesion to ceramic, epoxy and polyimide substrates
  • Protection from moisture, dirt and other contaminants
  • One-part elastomer with fast heat cure

性能

这些数值为典型性能,并且不用于在规格制定过程中使用。

典型性能

  • 动力粘度 45000 Centipoise
  • 比重 @ 25C 1.15
  • 热固化 60 Minutes @ 150 Deg C
  • 硬度-Shore A 28 Shore A
  • 组分 单组份
  • 颜色 深灰色

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DOWSIL™ ME-4139 Encapsulant Dark Grey
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DOWSIL™ ME-4139 Encapsulant Dark Grey
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