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DOWSIL™ ME-4139 Encapsulant Dark Grey

概述
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单组分、深灰色、热固化、可控粘稠性、点胶时流动、自吸粘附能力。

用途:

Where a semiconductor die has been wire bonded to a flat surface.
Where there is a need for a flexible coating
- wide extremes of temperature, with the use of a pliable epoxy substrate or where severe thermal shocks are encountered
Compatible with most semiconductor devices and provides environmental and physical protection of both the chip and interconnecting wires in a single application

优势:

High purity
Controlled thixotropy and yet flowable as dispensed
Optimum coating to cover bonding wires
Flexibility over a wide temperature range
Excellent dielectric properties
Excellent adhesion to ceramic, epoxy and polyimide substrates
Protection from moisture, dirt and other contaminants
One-part elastomer with fast heat cure

性能

这些数值为典型性能，并且不用于在规格制定过程中使用。

典型性能

动力粘度 是否 45000 Centipoise
比重 @ 25C 是否 1.15
热固化 是否 60 Minutes @ 150 Deg C
硬度-Shore A 是否 28 Shore A
组分是否单组份
颜色是否深灰色