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  2. DOWSIL™ ME-1180 Adhesive Clear

DOWSIL™ ME-1180 Adhesive Clear

One-part, heat cure, translucent, self-priming adhesive.

用途:

  • Die Attach Adhesive, Globe top encapsulation
  • Sealing, encapsulation, adhesive for PCB system assemblies

优势:

  • Proven excellent jet dispensability which enables:
    • Design flexibility with fine, precise patterning
    • Ease to optimize parameter for jet dispensing
  • Solvent-less, low viscosity
  • Well balanced thixo and flow properties
  • Moderate Young's modulus
  • Volatile controlled

性能

这些数值为典型性能，并且不用于在规格制定过程中使用。

典型性能

  • 固化特点 是 否 加热固化 > 100C
  • 特性 是 否 单组份
  • 颜色 是 否 Translucent/Clear
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