性能
产品使用和配方 |
|
|---|---|
| Cure Characteristics | Heat Cure greater than 100C |
典型特性 |
|
|---|---|
| Color | Translucent/Clear |
| Number of Parts | One Part |
| Product Type | Adhesive / Sealant |
DOWSIL™ ME-1180 Adhesive Clear
概述
性能
技术内容
样品选项
什么是 DOWSIL™ ME-1180 Adhesive Clear?
One-part, heat cure, translucent, self-priming adhesive.
用途
- Die Attach Adhesive, Globe top encapsulation
- Sealing, encapsulation, adhesive for PCB system assemblies
优势
- Proven excellent jet dispensability which enables:
- Design flexibility with fine, precise patterning
- Ease to optimize parameter for jet dispensing
- Solvent-less, low viscosity
- Well balanced thixo and flow properties
- Moderate Young's modulus
- Volatile controlled