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DOWSIL™ EG-3896 Kit

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Suitable for potting and protecting of electronics devices, especially power semiconductor modules to protect dies and interconnects from environmental conditions and to provide dielectric insulation.

性能

这些数值为典型性能，并且不用于在规格制定过程中使用。

关键属性

混合后的粘度 是否 520 Centipoise

典型性能

介电常数 100 kHz 是否 2.9
介电常数 1MHz 是否 2.9
介电强度 是否 559 volts per mil v/mil
介电强度（kV/mm） 是否 22 kV/mm
体积电阻率 是否 2e+015 Ω・cm
凝胶硬度 是否 220 Grams/Penetration (1
可操作时间 是否 > 240 Minutes
损耗因子 100 kHz 是否 4.6e-005
温度范围 是否 -40 to 185 °C
热固化 是否 10 Minutes @ 100 Deg C, 30 Minutes @ 70 Deg C, 5 Minutes @ 150 Deg C
组分是否双组份