DOWSIL™ EE-3200 Low Stress Silicone Encapsulant

硬度和粘度非常低，尽量减少内部应力生成，填补小间隙，提高复杂和高容量电子设备的制造速度。

优势:

Low modulus reduces pressure on components
Thermal conductivity effectively dissipates heat
Good mechanical adhesion avoids delamination issues
Fast cure and optimized working time allows for more complex designs and lower module cost
Dielectric strength and volume resistivity reduce costs as no additional dielectric barrier is required
Ease of use – low viscosity allows fast fill and fit with high throughput manufacturing processes
Minimal filler settling allows for ease of process control
Meets certification requirements

这些数值为典型性能，并且不用于在规格制定过程中使用。

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