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DOWSIL™ EE-3200 Low Stress Silicone Encapsulant

硬度和粘度非常低,尽量减少内部应力生成,填补小间隙,提高复杂和高容量电子设备的制造速度。

优势:

  • Low modulus reduces pressure on components
  • Thermal conductivity effectively dissipates heat
  • Good mechanical adhesion avoids delamination issues
  • Fast cure and optimized working time allows for more complex designs and lower module cost
  • Dielectric strength and volume resistivity reduce costs as no additional dielectric barrier is required
  • Ease of use – low viscosity allows fast fill and fit with high throughput manufacturing processes
  • Minimal filler settling allows for ease of process control
  • Meets certification requirements

性能

这些数值为典型性能,并且不用于在规格制定过程中使用。

关键属性

  • 混合后的粘度 1700 Centipoise

典型性能

  • 介电常数 100 Hz 2.7
  • 介电常数 100 kHz 2.7
  • 介电常数 1MHz 2.7
  • 介电强度 350 volts per mil v/mil
  • 介电强度 (kV/mm) 14 kV/mm
  • 体积电阻率 1e+015 Ω・cm
  • 单组分或双组分 双组份
  • 可操作时间 30 Minutes
  • 固化特点 室温延长工作时间 > 20 分钟
  • 导热率 0.5 W/m・K
  • 应用温度范围 -45 to 200 °C
  • 延伸率 340 %
  • 拉伸强度 33 psi
  • 损耗因子 100 Hz 0.006
  • 损耗因子 100 kHz 0.0008
  • 杨氏模量 12.7 psi
  • 特性 UL 认可
  • 硬度 高应力消除弹性体 000, 00 范围
  • 粘度/流动性 高流量 500 - 3000 cps
  • 粘度(组分A) 1400 mPa.s
  • 粘度(组分B) 2000 mPa.s
  • 线性热膨胀系数 360 um/m/Deg C
  • 颜色 - 组分B 黑色

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DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
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DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
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