性能
应用优势 |
|
|---|---|
| Use | Boards and Assemblies, Components |
典型特性 |
|
|---|---|
| Linear CTE | 300 um/m/Deg C |
DOWSIL™ EE-1010 Low Viscosity Encapsulant Kit
概述
性能
技术内容
样品选项
什么是 DOWSIL™ EE-1010 Low Viscosity Encapsulant Kit?
适合用于在制造过程中需要频繁启动/停止的应用，或者用于因电路板和组件的复杂性而导致需要更多的时间来排出留截空气、使其上升到表面和断裂且无需真空排气步骤的应用。
用途
- DOWSIL™ EE-1010 Low Viscosity Encapsulant is suitable for use in applications where there are frequent start/stops during the manufacturing process or where board and component complexity require more time for entrapped air to be displaced, rise to the surface, and break without requiring a vacuum de-airing step
- Material can be dispensed manually or through meter mixing
优势
- Long working time
- Room temperature cure or accelerated heat cure
- High hardness/durometer compared to other PCB system assemblies encapsulants
- Moderate thermal conductivity
- Different colors for Part A and Part B for easy identification of mixing
- In complex geometries, low viscosity enhances flow and fill in narrow spaces and long working time enables air displacement
- Rapid, versatile cure processing controlled by temperature