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DOWSIL™ EE-1010 Low Viscosity Encapsulant Kit

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技术内容
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适合用于在制造过程中需要频繁启动/停止的应用，或者用于因电路板和组件的复杂性而导致需要更多的时间来排出留截空气、使其上升到表面和断裂且无需真空排气步骤的应用。

性能

这些数值为典型性能，并且不用于在规格制定过程中使用。

关键属性

混合后的粘度 是否 840 Centipoise

典型性能

介电强度 是否 450 volts per mil v/mil
介电强度（kV/mm） 是否 18 kV/mm
单组分或双组分 是否双组份
固化特点 是否加热固化 < 100C 工作时间长 > 15 分钟
导热率 是否 0.35 W/m・K
应用温度范围 是否 -45 to 200 °C
损耗因子 100 kHz 是否 0.001
比重是否 1.25
热固化 是否 2 Minutes @ 150 Deg C, 3 Minutes @ 100 Deg C
硬度是否刚度更高 >50A
硬度-Shore A 是否 60 Shore A
粘度/流动性 是否高流量 500 - 3000 cps
粘度（组分A） 是否 1020 mPa.s
粘度（组分B） 是否 600 mPa.s
线性热膨胀系数 是否 300 um/m/Deg C
组分是否双组份