什么 DOWSIL™ EA-6247 Thermally Conductive Adhesive?
触变导热胶，抗拉强度高
用途
- Attaching ceramic circuitry
- Base plate attach
- Heat sink attach
- Lid and housing bonding
优势
- Thixotropic - increased flowability under shear/dispense
- Heat Cure
- Outstanding thermal conductivity values
- High tensile strength
- No added solvents
- No mixing of separate components required
- Rapid, versatile cure processing controlled by temperature
- Able to flow, fill or self-leveling after dispensing
- Heat flow away from circuitry components can increase reliability