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  2. DOWSIL™ CN-8760 G Thermally Conductive Encapsulant

DOWSIL™ CN-8760 G Thermally Conductive Encapsulant

由双组分组成、1:1、室温和可热固化以提供制造灵活性，导热性适中。

性能

这些数值为典型性能，并且不用于在规格制定过程中使用。

典型性能

  • 单组分或双组分 是 否 双组份
  • 固化特点 是 否 加热固化 > 100C, 室温延长工作时间 > 20 分钟
  • 室温固化 是 否 >24 小时
  • 特性 是 否 UL 认可, 低热导率
  • 特殊性能 是 否 UL 登记, 导热
  • 硬度 是 否 中等硬度 20A-50A
  • 粘度/流动性 是 否 控制流量 3000 - 10,000 cps
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