性能

性能评级

Adhesion Medium
High High

应用优势

Feature Compatible with Low Energy Substrates

典型特性

Cure Chemistry Peroxide
Nonvolatile Content 60 %
Shelf Life 360 Days
Use Heat Seal Tapes, Insulation Tapes, Plating Tapes, Splicing Tapes
Viscosity 114000 mPa.s