性能
性能评级 |
|
|---|---|
| Adhesion | Medium |
应用优势 |
|
|---|---|
| Feature | Low Volatiles |
典型特性 |
|
|---|---|
| Cure Chemistry | Peroxide |
| Nonvolatile Content | 56 % |
| Use | Electrical and Electronic Tapes, Heat Shielding Tapes, Plating Tapes, Splicing Tapes |
| Viscosity | 31300 mPa.s |