性能
性能评级 |
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Adhesion | Medium |
应用优势 |
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Feature | Low Volatiles |
典型特性 |
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Cure Chemistry | Peroxide |
Nonvolatile Content | 56 % |
Use | Electrical and Electronic Tapes, Heat Shielding Tapes, Plating Tapes, Splicing Tapes |
Viscosity | 31300 mPa.s |