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DOWSIL™ 340 Heat Sink Compound

概述
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白色、不流动、高度填充的化合物，导热性良好。

用途:

Designed for thermal coupling of electrical devices and PCB assemblies to heat sinks

优势:

Thermally conductive compound
1 part
Non flowing
No need for ovens or curing
Increases reliability with heat flow away from circuitry components

性能

这些数值为典型性能，并且不用于在规格制定过程中使用。

典型性能

Color 是否 White
Nonflowable 是否 Yes
Shelf Life 是否 1800 Days
增稠系统 是否金属氧化物
导热率 是否 0.67 W/m・K
比重 @ 25C 是否 2.1
粘度是否 542000 mPa.s
组分是否单组份

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DOWSIL™ 340 Heat Sink Compound

用途:

优势:

性能

典型性能

目前没有捆绑价格

如需了解更多信息，请联系陶氏公司。