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DOWSIL™ 340 Heat Sink Compound

概述
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白色、不流动、高度填充的化合物，导热性良好。

用途:

Designed for thermal coupling of electrical devices and PCB assemblies to heat sinks

优势:

Thermally conductive compound
1 part
Non flowing
No need for ovens or curing
Increases reliability with heat flow away from circuitry components

性能

这些数值为典型性能，并且不用于在规格制定过程中使用。

典型性能

不流动 是否 true
保质期 是否 1800 Days
增稠系统 是否金属氧化物
导热率 是否 0.67 W/m・K
工作锥入度 是否 290 mm/10
抵御种类 是否热阻, 耐臭氧
比重 @ 25C 是否 2.1
温度稳定性 是否弱/低, 强/高
粘度是否 542000 mPa.s
组分是否单组份
颜色是否白色