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  2. DOWSIL™ 3-6752 Thermally Conductive Adhesive

DOWSIL™ 3-6752 Thermally Conductive Adhesive

单组分、灰色、UL 94 V-0 等级，快速热固化和无底质粘接电子产品行业中使用的普通基材。

用途:

  • Bonding organic and ceramic substrates to heat sinks for electronic control modules in automotive applications
  • Requiring added flame resistance

优势:

  • Thermally conductive adhesive
  • No added solvents
  • 1 part
  • Thixotropic - increase flowability under sehar/dispense
  • Good flame resistance
  • Heat cure with rapid versatile processing controlled by temperature
  • Increase reliability with heat flow away from circuitry components

性能

这些数值为典型性能，并且不用于在规格制定过程中使用。

典型性能

  • Color 是 否 Grey
  • Dielectric Strength 是 否 400 volts per mil v/mil
  • Flowable 是 否 Yes
  • Heat Cure 是 否 10 Minutes @ 125 Deg C, 3 Minutes @ 150 Deg C, 40 Minutes @ 100 Deg C
  • Primerless Adhesion 是 否 Yes
  • Shelf Life 是 否 183 Days
  • Water Resistant 是 否 Yes
  • 介电常数 100 Hz 是 否 5.64
  • 介电常数 100 kHz 是 否 1
  • 体积电阻率 是 否 7.1e+013 Ω・cm
  • 动力粘度 是 否 83300 Centipoise
  • 导热率 是 否 1.7 W/m・K
  • 延伸率 是 否 15 %
  • 拉伸强度 是 否 545 psi
  • 损耗因子 100 Hz 是 否 0.007
  • 损耗因子 100 kHz 是 否 < 0.0001
  • 比重 @ 25C 是 否 2.61
  • 硬度-Shore A 是 否 87 Shore A
  • 自流平 是 否 Yes
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DOWSIL™ 3-6752 Thermally Conductive Adhesive
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DOWSIL™ 3-6752 Thermally Conductive Adhesive
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