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DOWSIL™ TC-5888 Thermally Conductive Compound

Gray, thixotropic, non-curing thermally conductive compound. Thermally Conductive Compound is designed to provide efficient thermal transfer for the cooling of modules, including computer MPUs and power modules.

优势:

  • One-Part Material: No cure is required when applying the material.
  • Excellent Stay-ability: Features unique rheological properties that limit its flow beyond a target interface once assembled. This flow characteristic distinguishes it from lower viscosity thermal compounds, and provides greater control for applications requiring a thicker thermal compound layer or greater precision when dispensing compound between surface interfaces.
  • Thermal Stability: Delivers consistent performance and reliability under high temperatures.
  • Good Processability: Offers low volatile content versus competitive thermal compounds, allowing for more consistent rheology, application repeatability, and easier screen printing overall.
  • DOWSIL™ 7091 Adhesive Sealant
    High performance, neutral cure silicone adhesive/sealant.

  • DOWSIL™ TC-5026 Thermally Conductive Compound
    Designed to provide efficient thermal transfer for the cooling of MPU in servers, desktops, notebooks, and game consoles.

  • DOWSIL™ TC-5622 Thermally Conductive Compound

    These are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability.


  • DOWSIL™ 3-4207 Dielectric Tough Gel Kit
    Two-part, translucent green, fast RT or heat cure, tough, primerless chemical adhesion, UV indicator, and UL 94 V-1 flammability classification.

  • DOWSIL™ TC-2035 Adhesive A/B Kit
    Two-part heat cure silicone highly thermally conductive adhesive with low bond line thickness.

  • DOWSIL™ SE 4485 Thermally Conductive Adhesive
    Designed to provide efficient thermal transfer for the cooling of electronics modules, including lamp, telecom, and power supply devices. It is a one-part, white, moisture cure, thermal conductivity silicone adhesive.

  • DOWSIL™ TC-5351
    Suitable for use as a thermally conductive material in power electronics. It is a one-part grey, and non-curing thermally conductive compound.

  • SYLGARD™ 170 Silicone Elastomer Kit
    Two-part, black, 1:1, RT or heat cure, low viscosity, general purpose, UL and Mil Spec.

  • DOWSIL™ 2634 Coating

    New alkoxysilane functional perfluoropolyether (PFPE) hybrid polymers that exhibit the synergistic effects of the oleophobicity and low coefficient of friction of fluoro-polymers and the hydrophobicity and durability of silicone. Improved abrasion and UV durability over current chemical treatments are obtained with the use of a mono-functional terminal alkoxy silane to the PFPE polymer. The alkoxy silane reactive end will covalently bond to the surface via hydrolysis and con-densation reactions, resulting in a structurally ordered chemical modi-fication of the surface. This covalent bond gives the needed durability in applications such as touch-screen displays.


  • DOWSIL™ TC-4535 CV Thermally Conductive Gap Filler
    A soft and compressible material once cured, designed to dissipate the heat from PCB module assemblies mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission control unit.

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DOWSIL™ TC-5888 Thermally Conductive Compound
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DOWSIL™ TC-5888 Thermally Conductive Compound


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DOWSIL™ TC-5888 Thermally Conductive Compound
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