DOWSIL™ TC-5888 Thermally Conductive Compound
- One-Part Material: No cure is required when applying the material.
- Excellent Stay-ability: Features unique rheological properties that limit its flow beyond a target interface once assembled. This flow characteristic distinguishes it from lower viscosity thermal compounds, and provides greater control for applications requiring a thicker thermal compound layer or greater precision when dispensing compound between surface interfaces.
- Thermal Stability: Delivers consistent performance and reliability under high temperatures.
- Good Processability: Offers low volatile content versus competitive thermal compounds, allowing for more consistent rheology, application repeatability, and easier screen printing overall.
DOWSIL™ 7091 Adhesive Sealant
High performance, neutral cure silicone adhesive/sealant.
DOWSIL™ TC-5026 Thermally Conductive Compound
Designed to provide efficient thermal transfer for the cooling of MPU in servers, desktops, notebooks, and game consoles.
DOWSIL™ TC-5622 Thermally Conductive Compound
These are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability.
DOWSIL™ 3-4207 Dielectric Tough Gel Kit
Two-part, translucent green, fast RT or heat cure, tough, primerless chemical adhesion, UV indicator, and UL 94 V-1 flammability classification.
DOWSIL™ TC-2035 Adhesive A/B Kit
Two-part heat cure silicone highly thermally conductive adhesive with low bond line thickness.
DOWSIL™ SE 4485 Thermally Conductive Adhesive
Designed to provide efficient thermal transfer for the cooling of electronics modules, including lamp, telecom, and power supply devices. It is a one-part, white, moisture cure, thermal conductivity silicone adhesive.
Suitable for use as a thermally conductive material in power electronics. It is a one-part grey, and non-curing thermally conductive compound.
SYLGARD™ 170 Silicone Elastomer Kit
Two-part, black, 1:1, RT or heat cure, low viscosity, general purpose, UL and Mil Spec.
DOWSIL™ 2634 Coating
New alkoxysilane functional perfluoropolyether (PFPE) hybrid polymers that exhibit the synergistic effects of the oleophobicity and low coefficient of friction of fluoro-polymers and the hydrophobicity and durability of silicone. Improved abrasion and UV durability over current chemical treatments are obtained with the use of a mono-functional terminal alkoxy silane to the PFPE polymer. The alkoxy silane reactive end will covalently bond to the surface via hydrolysis and con-densation reactions, resulting in a structurally ordered chemical modi-fication of the surface. This covalent bond gives the needed durability in applications such as touch-screen displays.
DOWSIL™ TC-4535 CV Thermally Conductive Gap Filler
A soft and compressible material once cured, designed to dissipate the heat from PCB module assemblies mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission control unit.
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