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DOWSIL™ EG-3896 Kit

Suitable for potting and protecting of electronics devices, especially power semiconductor modules to protect dies and interconnects from environmental conditions and to provide dielectric insulation.

性能

这些数值为典型性能,并且不用于在规格制定过程中使用。

  • Dielectric Constant at 100 kHz 2.9
  • Dielectric Constant at 1MHz 2.9
  • Dielectric Strength 559 volts per mil v/mil
  • Dielectric Strength (kV/mm) 22 kV/mm
  • Dissipation Factor at 100 kHz 4.6e-005
  • Gel Hardness 220 Grams/Penetration (1
  • Heat Cure 30 Minutes @ 70 Deg C, 10 Minutes @ 100 Deg C, 5 Minutes @ 150 Deg C
  • Mixing Viscosity 520 Centipoise
  • Number of Parts 双组份
  • Temperature Range -40 to 185 °C
  • Volume Resistivity 2e+015 ohm-centimeters
  • Working Time > 240 Minutes

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DOWSIL™ EG-3896 Kit
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DOWSIL™ EG-3896 Kit


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DOWSIL™ EG-3896 Kit
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