装配、双面和无基材胶带 | 陶氏公司

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装配、双面和无基材胶带

有机硅压敏粘合剂

如今的电子设备要求制造商在众多因素中平衡成本和性能，从粘合强度和电气性能到基材和加工参数。陶氏提供创新的有机硅压敏粘合剂 (PSA)，可为各种电子应用和环境优化性能。我们的有机硅PSA具有有机粘合剂无法匹敌的关键优势。

用于电子装配胶带的PSA

对于需要粘接、临时固定或可移动RFID标签的电子装配胶带应用，陶氏的PSA产品提供：

出色的一致性
耐高温性
耐化学性
清洁可移动性
低迁移率
与PE、PI和PTFE背衬兼容

用于无基材胶带和标签的PSA

对于无基材胶带和标签应用，如表面改性、遮蔽胶带、零件粘合、汽车/电气标签或特种标签，陶氏的PSA解决方案提供：

宽广的工作温度范围
防潮/防紫外线
对低能量表面的附着力
易于剥离性
与各种氟硅氧烷涂层的防粘衬里背衬兼容

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技术内容

查找合适的解决方案（英语）
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