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电源和模块

打开电源并关闭热源

更高的电压输出、更高的功率密度和更快的切换速度是对需驱动电源和模块的电子系统需要更先进的导热解决方案的热门趋势。陶氏的导热有机硅可以帮助散热,并提高即使是功率最大的高密度半导体的可靠性。

为何选择有机硅?

从微型逆变器和功率优化器到计算机服务器和电源,改善热管理是电源和模块长期性能和可靠性的普遍要求。有机硅具有卓越的耐热性,薄而轻,非常适合填充形状独特的缝隙,并能形成较大的接触面积以实现最大的导热性能。

如何选择有机硅?

陶氏有机硅适合广泛的防护型应用。

  • ]我们的导热弹性体和凝胶 ]提供多种热管理解决方案,具有不同的硬度或应力消除水平,以满足您应用的特定需求。这些产品固化前的低粘度使其能够轻松加工并完全嵌入高组件、精密的电线和焊接接缝,特别适合管理复杂结构中的高热量。
  • ]我们的导热粘合剂 可粘合和密封混合电路基板、半导体元件、散热器,以及其他需要广泛设计、灵活处理方案和出色热管理的应用。
  • 我们的导热化合物 特别适合应用于复杂的结构中。它们甚至可填充最小的间隙,并充当热桥,从电源大部分敏感元件中吸收热量并排放出去。这些未固化的材料具有低热阻、高导热性,并能通过非常薄的线厚度提供强力粘合。

快速链接

解决下一代电源模块 的散热问题
高温有机硅 凝胶先进 热保护。

DOWSIL™ EG-3810凝胶
用于大功率IGBT的灌封以起到防护作用

DOWSIL™ EG-3896介电凝胶 
应对热量和环境以实现终极 IGBT 保护。