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true

电信

迎接依赖高速连接的设备的挑战

如今的消费者都在寻找速度更快的高功率电子设备。陶氏的聚合物波导有机硅、聚氨酯和环氧树脂溶液、粘合剂、间隙填料和导电化合物可以提高电信产品(包括印刷电路板(PCB)的耐用性和可靠性。了解如何实现:

  • 广泛而又出色的温度稳定性
  • 热膨胀引起的机械应力下的耐久性
  • 额外的抗冲击和振动保护
  • 更强的耐化学品性
  • 毒性降低且固化快
  • 改善数据传输性能

快速链接