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DOWSIL™ TC-4026 Dispensable Thermal Pad Kit

由双组分组成的 1:1 混合比导热可涂布式垫片

用途:

  • Cooling pcb system assemblies in LED lamps and luminaries, automotives, and consumer applications
  • Applications requiring screen printing and/or dispensable materials
  • Applications to replace a traditional fabricated pad

优势:

  • Thermally conductive dispensable thermal pad
  • 2 part
  • Screen printable or dispensable pad via auotmoated or manual process
  • Soft, stress relieving, shock damping
  • Reworkable
  • Glass beads to help control thickness during dispense, cure, and application
  • Room temperature cure that can be accelerated with heat
  • Increase reliability with heat flow away from circuitry components

性能

这些数值为典型性能,并且不用于在规格制定过程中使用。

典型性能

  • Dielectric Strength 451 volts per mil v/mil
  • Heat Cure 10 Minutes @ 125 Deg C, 145 Minutes @ 40 Deg C, 15 Minutes @ 100 Deg C, 40 Minutes @ 75 Deg C
  • 介电常数 100 Hz 6.7
  • 介电常数 100 kHz 6.4
  • 介电常数 1MHz 6.4
  • 体积电阻率 3.9e+012 Ω・cm
  • 导热率 2.5 W/m・K
  • 延伸率 200 %
  • 拉伸强度 24 psi
  • 损耗因子 100 Hz 0.08
  • 损耗因子 100 kHz 0.001
  • 硬度-Shore 00 50
  • 组分 双组份

此材料没有安全数据说明书
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DOWSIL™ TC-4026 Dispensable Thermal Pad Kit
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DOWSIL™ TC-4026 Dispensable Thermal Pad Kit
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