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  2. DOWSIL™ TC-4026 Dispensable Thermal Pad Kit

DOWSIL™ TC-4026 Dispensable Thermal Pad Kit

由双组分组成的 1:1 混合比导热可涂布式垫片

用途:

  • Cooling pcb system assemblies in LED lamps and luminaries, automotives, and consumer applications
  • Applications requiring screen printing and/or dispensable materials
  • Applications to replace a traditional fabricated pad

优势:

  • Thermally conductive dispensable thermal pad
  • 2 part
  • Screen printable or dispensable pad via auotmoated or manual process
  • Soft, stress relieving, shock damping
  • Reworkable
  • Glass beads to help control thickness during dispense, cure, and application
  • Room temperature cure that can be accelerated with heat
  • Increase reliability with heat flow away from circuitry components

性能

这些数值为典型性能，并且不用于在规格制定过程中使用。

典型性能

  • 介电常数 100 Hz 是 否 6.7
  • 介电常数 100 kHz 是 否 6.4
  • 介电常数 1MHz 是 否 6.4
  • 介电强度 是 否 451 volts per mil v/mil
  • 介电强度 （kV/mm） 是 否 18 kV/mm
  • 体积电阻率 是 否 3.9e+012 Ω・cm
  • 导热率 是 否 2.5 W/m・K
  • 延伸率 是 否 200 %
  • 拉伸强度 是 否 24 psi
  • 损耗因子 100 Hz 是 否 0.08
  • 损耗因子 100 kHz 是 否 0.001
  • 热固化 是 否 10 Minutes @ 125 Deg C, 145 Minutes @ 40 Deg C, 15 Minutes @ 100 Deg C, 40 Minutes @ 75 Deg C
  • 硬度-Shore 00 是 否 50 Shore 00
  • 粘度（组分A） 是 否 73000 mPa.s
  • 粘度（组分B） 是 否 74000 mPa.s
  • 组分 是 否 双组份
  • 非挥发含量 是 否 99.7 %
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DOWSIL™ TC-4026 Dispensable Thermal Pad Kit
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DOWSIL™ TC-4026 Dispensable Thermal Pad Kit
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